建構半導體晶圓廠整廠績效指標架構與全面資源管理

Abstract

半導體產業依據摩爾定律持續以進行製程技術提升外，還需要製造管理技術和資源管理效益提升才能面對激烈的產業競爭。然而，既有研究偏重於現場管理與生產力的提升，少有針對整廠績效評估架構和個別指標的連結。本研究目的為建構半導體晶圓廠整廠績效指標架構，由文獻回顧與專家訪談，整理整廠績效指標需具備的要素，探討指標之影響關係以建構整廠績效指標架構，供決策者全面管理半導體晶圓廠，發揮全面資源管理優勢以提昇競爭力。本研究以某半導體企業為實證，針對市場需求、原物料成本的變化情形，利用龍捲風圖進行多個單因子的敏感度分析，探討各情況下的指標改善方向及其影響，提供管理者在不同情況時的決策建議及其重點改善方向，實證研究結果已證明本研究效度。

Semiconductor industry has been following the Moore's Law (Moore, 1965) that the number of transistors fabricated on a wafer will be doubled every 12 or 24 months to advance the technology. However, most studies focus on the optimization of performance indices dividedly which lack of the view of fab as a whole. This study aims to construct a semiconductor overall fab performance indices framework. The performance index hierarchy structure can sort out the relationships between indices to link with overall effectiveness for fab operations. In particular, we conduct an empirical study in a leading semiconductor company for validation. Through sensitivity analysis of tornado diagram, empirical decision rules for different important key performance indices can be derived for different situations to support decision makers for effective operation management. The results have shown practical viability of the proposed approach.