主動式控溫系統條件對低溫IC接面溫度之影響

Abstract

電子產品應用廣泛，電子設備也朝向集成度更高，功率更大，要求更嚴格的方向發展，所以目前業界非常重視IC測試製程溫度環境。

探討主動式控溫系統參數設定與IC測試所讀取結面溫度的關係，作為生產前機台參數設定參考原則，讓機台參數設定能最佳化，而有效提升生產良率。

利用流體模擬分析軟體”ANSYS Fluent”，進行模擬溫度控制之系統中IC接面溫度的情況，及配合冷卻機流體的壓力設定，來探討冷卻機參數設定對IC結面溫度的影響。

研究結果發現主動式控溫系統中低溫流體壓力設定在0.7Mpa至0.75Mpa，其測試中IC的結面溫度能趨近所需要範圍。在整個IC測試的熱系統中，雖然有多個熱阻介面層，但以晶片至散熱片熱阻為影響結面溫度的主要因素。

藉由所建立分類機中主動式控溫系統的模擬熱系統進行分析，而獲得測試中IC的各個介面層熱傳關係，並驗證實際機台上所量測IC的結面溫度與模擬差異。藉由這分析探討，使得對主動控溫系統更加了解，有利往後在工作實務上能有效運用。

The electronic products are widely used, electronic equipment also turn toward higher integration, bigger power , and request strictly to develop, at present, therefore the industry of the IC testing attaches great importance to environmental temperature for IC testing.

The purpose of this research make to investigate relation between junction temperature reading of the IC by testing program and equipment parameters setting of the active thermal control system.

To conduct setting parameters of the system in principle of the reference before production, let system's setting of the parameter can effectively improve production yield.

Using ANSYS fluent that is software for fluid analysis to simulate situation of IC's junction temperature with temperature control system. To collocate fluid pressure setting of the chiller to study the effect of chillers parameters setting on IC's junction temperature.

The results shown fluid pressure of active thermal control system set 0.7Mpa to 0.75Mpa , get approaches to required junction temperature range of the IC during the testing. Although there are a lots thermal resistance layers in the thermal system ,and the thermal resistance between chip and heat sink affect the junction temperature of primary factor .

With buildup thermal systems for simulation analysis of active thermal control system in the handler , to obtained IC's thermal transfer relationship during the testing ,and compared verify actual junction temperature reading of the IC. In the future of the work, the study can be effectively used.