BN & Silicone複材熱傳導性能提升實驗

Abstract

近年來隨著半導體技術的蓬勃發展，電子元件朝輕、薄、短、小與高積集密度演變過程中，電子元件在工作時伴隨產生的廢熱如無法適時排除，除了會造成電子訊號失真降低可靠性，更甚者將導致元件損壞，因此各研究機構莫不積極投入降低元件發熱功率或提升散熱機制。氮化硼在電子應用材料中為十分熱門的原料，其被應用的潛力源自於其擁有良好的電絕緣性，低介電常數與介電損失。 本論文研究內容為針對BN 及 Al2O3 的導熱機制，我們希望能在 BN 的表面進行改質，我們可選擇性地在 BN 表面改質上所需的官能基，增加無機材料在高分子中的分散性；再將此高分子複合材料噴塗在物體表面，高溫熱固後可以有效提升物體的散熱性

The rapid development of semiconductor technology, electronic components towards the light、thin、short、small and high-density evolution of the product in recent years. The waste heat generated in the electronic components during operation ,if we can’t remove these waste heat . These waste heat will effect electronic signals and cause distortion lower reliability, or worse still will lead to component damage. So everyone actively involved in various research institutions to reduce power or heating elements to enhance heat dissipation mechanism. Boron nitride material for electronic applications very popular material, which comes from its potential to be applied with good electrical insulation properties, low dielectric constant and dielectric loss. This paper is for thermal mechanism of BN and Al2O3 .We would like to modify on the surface of BN to improve dispersibility in Silicon, and sprate this composite on electronic component to improve better thermal conductivity.