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dc.contributor.authorKer, MDen_US
dc.contributor.authorLin, KHen_US
dc.contributor.authorChuang, CHen_US
dc.date.accessioned2014-12-08T15:19:40Z-
dc.date.available2014-12-08T15:19:40Z-
dc.date.issued2005-03-01en_US
dc.identifier.issn0916-8524en_US
dc.identifier.urihttp://dx.doi.org/10.1093/ietele/e88-c.3.429en_US
dc.identifier.urihttp://hdl.handle.net/11536/13980-
dc.description.abstractNew diode structures without the field-oxide boundary across the p/n junction for ESD protection are proposed. A NMOS (PMOS) is especially inserted into the diode structure to form the NMOS-bounded (PMOS-bounded) diode, which is used to block the field oxide isolation across the p/n junction in the diode structure. The proposed N(P)MOS-bounded diodes can provide more efficient ESD protection to the internal circuits, as compared to the other diode structures. The N(P)MOS-bounded diodes can be used in the I/O ESD protection circuits, power-rail ESD clamp circuits, and the ESD conduction cells between the separated power lines. From the experimental results, the human-body-model ESD level of ESD protection circuit with the proposed N(P)MOS-bounded diodes is greater than 8 kV in a 0.35-mu m CMOS process.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectdiodeen_US
dc.subjectpoly-bounded diodeen_US
dc.subjectMOS-bounded diodeen_US
dc.subjectESD protectionen_US
dc.titleMOS-bounded diodes for on-chip ESD protection in deep submicron CMOS processen_US
dc.typeArticleen_US
dc.identifier.doi10.1093/ietele/e88-c.3.429en_US
dc.identifier.journalIEICE TRANSACTIONS ON ELECTRONICSen_US
dc.citation.volumeE88Cen_US
dc.citation.issue3en_US
dc.citation.spage429en_US
dc.citation.epage436en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000227827700019-
dc.citation.woscount1-
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