标题: | 高功率发光二极体晶片级封装应用金属薄膜封装技术改善散热 Thermal Improvement of High Power LED Chip Scale Package by Using Thin Metal Package Technique |
作者: | 王鼎杰 林伯昰 Wang, Ting-Chieh Lin, Bor-Shyh 光电科技学程 |
关键字: | 高功率发光二极体;晶片级封装;陶瓷散热基板;金属薄膜封装;光流明;色温;CSP;HPLED;MCPCB;Ceramic Substrate;TMP;junction temperature |
公开日期: | 2017 |
摘要: | 在应用发光二极体(LED)的固态照明中,随着晶片温度的升高,发光效率将降低。因此,散热是热管理的关键因素,特别是大功率LED应用。从LED封装结构分析,散热主要是藉由热传导模式从LED晶片载体基板,焊锡,系统板,到外界环境。诸如MCPCB和Al 2O3陶瓷等散热基板经常用于LED晶粒承载基座中加强散热。然而,当LED晶片封装尺寸接近晶片时,上述散热基板在散热效率将因接触面积缩小而降低,而且其中使用的绝缘金属基板(IMS)有较高热阻,这时反成为散热瓶颈。为了改善上述问题,本论文提出以金属薄膜封装(TMP),取代传统的LED载体基板,将LED透过金属薄膜与系统板连接,移除传统散热基板,将LED晶片的废热快速导至外界。热逸散系统中,热阻是检查材料导热能力的重要指标。在本研究中,对TMP和其他散热基板的热阻进行了研究和比较。从实验结果可以看出,所提出的TMP与传统散热基板相比,具有更好的散热性能和更低的热阻,从而大幅降低了LED结温升高时的相对光通量衰减和光学特性偏移。 In solid state lighting, such as light emitting diode (LED), the light emission efficiency will decrease with the temperature increase. Therefore, the heat dissipation is one of the key factors in thermal management, in particular, for high power LED applications. From the LED package structure, the contact mode is the major heat dissipation path that is from LED chips, LED grain carrier substrate, and solder board to ambient. The thermal substrates, such as MCPCB and Al2O3 ceramic substrate, are frequently used in LED grain carrier substrate for heat dissipation. However, when LED chip scale package (LED CSP) is close to the chip size, the efficiency of the above thermal substrates on heat dissipation is insufficient, and the higher thermal resistance of the insulated metal substrate (IMS) used in thermal substrate will also become the bottleneck of heat dissipation. In order to improve the above issue, thin metal package (TMP) substrate was proposed to replace the conventional LED grain carrier substrate to connect LED electrode to solder board, and quickly dissipate the heat. In thermal system, the thermal resistance is one important index to check the thermal conduction ability of materials. In this study, the thermal resistances of TMP and other substrates were investigated and compared. From the experimental results, the proposed TMP exactly provided better heat dissipation performance and lower thermal resistance than that of conventional thermal substrate to greatly reduce the loss of the relative luminous flux and optical characteristic shift with the increase of LED junction temperature. |
URI: | http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070458327 http://hdl.handle.net/11536/142378 |
显示于类别: | Thesis |