| 標題: | 摩擦界面終點監測技術在化學機械研磨(CMP)上的應用 Friction Interface Endpoint Detection for CMP Application |
| 作者: | 邱志成 張翼 Chiu,Chih-Cheng Chang,Yi 工學院半導體材料與製程設備學程 |
| 關鍵字: | 化學機械研磨;終點監測;晶圓過磨;摩擦力;Chemical mechanical polishing;in-situ endpoint detection;Friction |
| 公開日期: | 2017 |
| URI: | http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070461319 http://hdl.handle.net/11536/142400 |
| 顯示於類別： | 畢業論文 |
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- The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection / Wang, YL;Liu, C;Feng, MS;Tseng, WT
- The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection / Wang, YL;Liu, C;Feng, MS;Tseng, WT
- 應用順滑模態理論操作化學機械研磨製程 / 紀建宇;Chi, Chien-Yu;林家瑞;Lin, Chia-Shui
- 銅金屬嵌入式導線之化學機械研磨技術研究 / 陳辰靜;Cheng-Ging Chen;馮明憲;蔡明蒔;Dr. Ming-Shiann Fen
- Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect / Chen, KW;Wang, YL;Liu, CP;Yang, K;Chang, L
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