摩擦界面終點監測技術在化學機械研磨(CMP)上的應用

Full metadata record

DC Field	Value	Language
dc.contributor.author	邱志成	zh_TW
dc.contributor.author	張翼	zh_TW
dc.contributor.author	Chiu,Chih-Cheng	en_US
dc.contributor.author	Chang,Yi	en_US
dc.date.accessioned	2018-01-24T07:42:08Z	-
dc.date.available	2018-01-24T07:42:08Z	-
dc.date.issued	2017	en_US
dc.identifier.uri	http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070461319	en_US
dc.identifier.uri	http://hdl.handle.net/11536/142400	-
dc.language.iso	zh_TW	en_US
dc.subject	化學機械研磨	zh_TW
dc.subject	終點監測	zh_TW
dc.subject	晶圓過磨	zh_TW
dc.subject	摩擦力	zh_TW
dc.subject	Chemical mechanical polishing	en_US
dc.subject	in-situ endpoint detection	en_US
dc.subject	Friction	en_US
dc.title	摩擦界面終點監測技術在化學機械研磨(CMP)上的應用	zh_TW
dc.title	Friction Interface Endpoint Detection for CMP Application	en_US
dc.type	Thesis	en_US
dc.contributor.department	工學院半導體材料與製程設備學程	zh_TW
Appears in Collections:	Thesis