系統層級在手持式裝 置上之熱分析考慮網格最佳化

Abstract

為了不斷的提升手機晶片的性能，卻也導致手機出現過熱的情況，因此希望在設計時就能模擬出熱的問題，本篇論文著重於發展快速又精準計算出溫度的系統層級手機熱分析器。因為手機內部必須考慮內部的輻射與傳導效應才能更真實反應實際所測量的溫度，因此建立等效的物理模組以及利用網格的規劃使得分析溫度能更又效率且不失精準，我們與商業軟Icepak比較，在晶片溫度最大誤差能縮減至10%以下。

Because the high performance chip in smartphone presents serious thermal challenges, the designer hopes to be able to analyze the thermal problem at design stage. This thesis focuses on the development of fast and accurate system level thermal simulator for handheld devices. Because the smartphone structure must consider the heat transfer effects to analyze the temperature profile, building the physical equivalent model to simulate the heat transfer effects is an important issue. This thesis proposes the mesh approach and radiation model to simulate steady state analysis. Comparing our simulator with the commercial tool Icepak, the temperature error percentage at the chip can be less than 10%.