封裝材料對電子封裝翹曲之影響

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	王玟婷	zh_TW
dc.contributor.author	蔡佳霖	zh_TW
dc.contributor.author	Wang, Wen-Ting	en_US
dc.contributor.author	Tsai, Jia-Lin	en_US
dc.date.accessioned	2018-01-24T07:42:54Z	-
dc.date.available	2018-01-24T07:42:54Z	-
dc.date.issued	2015	en_US
dc.identifier.uri	http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070251066	en_US
dc.identifier.uri	http://hdl.handle.net/11536/143047	-
dc.language.iso	zh_TW	en_US
dc.subject	有限元素分析	zh_TW
dc.subject	最佳化	zh_TW
dc.subject	田口方法	zh_TW
dc.subject	電子封裝	zh_TW
dc.subject	翹曲	zh_TW
dc.subject	Finite element analysis	en_US
dc.subject	Optimization	en_US
dc.subject	Taguchi method	en_US
dc.subject	IC package	en_US
dc.subject	warpage	en_US
dc.title	封裝材料對電子封裝翹曲之影響	zh_TW
dc.title	Effect of package materials on warpage of IC package	en_US
dc.type	Thesis	en_US
dc.contributor.department	機械工程系所	zh_TW
顯示於類別：	畢業論文