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dc.contributor.author張耀仁zh_TW
dc.contributor.author陳冠能zh_TW
dc.contributor.authorChang, Yao-Jenen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2018-01-24T07:43:13Z-
dc.date.available2018-01-24T07:43:13Z-
dc.date.issued2016en_US
dc.identifier.urihttp://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070180107en_US
dc.identifier.urihttp://hdl.handle.net/11536/143230-
dc.language.isoen_USen_US
dc.subject三維積體電路zh_TW
dc.subject混和接合zh_TW
dc.subject矽晶直通孔zh_TW
dc.subject3DICen_US
dc.subjectHybrid bondingen_US
dc.subjectTSVen_US
dc.title三維積體電路關鍵技術與異質接合製程平台之電性與可靠度研究zh_TW
dc.titleDevelopment, Electrical Performance, and Reliability Investigations of 3-D ICs Key Technologies and Hybrid Bonding Process Platformen_US
dc.typeThesisen_US
dc.contributor.department電子工程學系 電子研究所zh_TW
顯示於類別:畢業論文