三維積體電路關鍵技術與異質接合製程平台之電性與可靠度研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	張耀仁	zh_TW
dc.contributor.author	陳冠能	zh_TW
dc.contributor.author	Chang, Yao-Jen	en_US
dc.contributor.author	Chen, Kuan-Neng	en_US
dc.date.accessioned	2018-01-24T07:43:13Z	-
dc.date.available	2018-01-24T07:43:13Z	-
dc.date.issued	2016	en_US
dc.identifier.uri	http://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070180107	en_US
dc.identifier.uri	http://hdl.handle.net/11536/143230	-
dc.language.iso	en_US	en_US
dc.subject	三維積體電路	zh_TW
dc.subject	混和接合	zh_TW
dc.subject	矽晶直通孔	zh_TW
dc.subject	3DIC	en_US
dc.subject	Hybrid bonding	en_US
dc.subject	TSV	en_US
dc.title	三維積體電路關鍵技術與異質接合製程平台之電性與可靠度研究	zh_TW
dc.title	Development, Electrical Performance, and Reliability Investigations of 3-D ICs Key Technologies and Hybrid Bonding Process Platform	en_US
dc.type	Thesis	en_US
dc.contributor.department	電子工程學系電子研究所	zh_TW
Appears in Collections:	Thesis