Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wen, Hua-Chiang | en_US |
dc.contributor.author | Chou, Wu-Ching | en_US |
dc.contributor.author | Lin, Po-Chen | en_US |
dc.contributor.author | Jeng, Yeau-Ren | en_US |
dc.contributor.author | Chen, Chien-Chang | en_US |
dc.contributor.author | Chen, Hung-Ming | en_US |
dc.contributor.author | Jiang, Don Son | en_US |
dc.contributor.author | Cheng, Chun-Hu | en_US |
dc.date.accessioned | 2018-08-21T05:52:53Z | - |
dc.date.available | 2018-08-21T05:52:53Z | - |
dc.date.issued | 2017-11-01 | en_US |
dc.identifier.issn | 0026-2714 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.microrel.2017.05.004 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/144058 | - |
dc.description.abstract | Using nanoindentation and energy dispersive X-ray spectrometry (EDS), we have conducted an investigation into corner failures to elucidate not only the nanomechanical properties of Sn-37Pb solder balls but also the effects of temperature cycling tests (TCTs). We found that the hardness of Sn-37Pb solder balls was greater in central locations [1.18 +/- 0.05 GPa for room-temperature (RT) sample; 1.3 +/- 0.05 GPa for TCT sample], but had standard values in corner locations (>0.2 +/- 0.02 GPa). The modulus increased after the TCTs. Nevertheless, the mechanical properties were closely related to the average area of the alpha-Pb phase. The average area of the Pb-rich region was more stable after the TCTs than that of the RT sample, due to the enhanced mechanical properties of the Sn-37Pb solder, suggesting good reliability. From an analysis of average areas in the RT sample, it appears that the Pb-rich solid solution that formed led to weak Sn-Pb bonds near the corner locations. Electron back scattered diffraction measurements revealed that grains with grain boundaries formed as a result of accelerated TCT cycling. We conclude that Sn-Pb recrystallization was initiated and propagated after the TCTs, followed by propagation to the interfacial region. (C) 2017 Published by Elsevier Ltd. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Intermetallic compounds | en_US |
dc.subject | Diffusion | en_US |
dc.subject | Recrystallization | en_US |
dc.subject | Electron microscopy | en_US |
dc.title | Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.microrel.2017.05.004 | en_US |
dc.identifier.journal | MICROELECTRONICS RELIABILITY | en_US |
dc.citation.volume | 78 | en_US |
dc.citation.spage | 111 | en_US |
dc.citation.epage | 117 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.contributor.department | Department of Electrophysics | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000414880200014 | en_US |
Appears in Collections: | Articles |