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dc.contributor.authorYang, Bo-Junen_US
dc.contributor.authorWu, Yu-Tingen_US
dc.contributor.authorChiu, Yung-Yuehen_US
dc.contributor.authorKuo, Tse-Mienen_US
dc.contributor.authorChang, Jung-Hoen_US
dc.contributor.authorWang, Pin-Yaoen_US
dc.contributor.authorShirota, Riichiroen_US
dc.date.accessioned2018-08-21T05:53:13Z-
dc.date.available2018-08-21T05:53:13Z-
dc.date.issued2018-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2017.2784419en_US
dc.identifier.urihttp://hdl.handle.net/11536/144404-
dc.description.abstractA method to analyze the kinetics of the charge accumulation in the tunnel oxide by the nand flash memory program and erase (P/E) cycling is proposed. Both electron trapping and detrapping processes are required to be considered owing to the oxide high electric field during P/E cycles. Consequently, the electron trapping in the deep trap state is concluded, whose trap energy (E-trap) is more than 3.5 eV. Furthermore, the as-grown trap state density (Ne), the trapping capture cross section (sigma), and the number of trapped positive charges can also be extracted to explain the tunneling current modulation and the V-T shift by oxide-trapped charges under the P/E stress. The trapped electrons are mainly distributed in the center of tunneloxide, and the distributed area extends as the P/E bias increases. In addition, the dependence of oxidation process is also shown. Both thermal dry and plasma oxidation have almost the same value of sigma (similar to 4x10(-17) cm(2)). However, 30% reduction of Ne is shown in plasma oxidation (similar to 1.25x10(19) cm(-3)) when compared with thermal dry oxidation (similar to 1.88 x 10(19) cm(-3)).en_US
dc.language.isoen_USen_US
dc.subjectFlash memory reliabilityen_US
dc.subjectplasma oxidationen_US
dc.subjectTRAPen_US
dc.titleEvaluation of the Role of Deep Trap State Using Analytical Model in the Program/Erase Cycling of NAND Flash Memory and Its Process Dependenceen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2017.2784419en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume65en_US
dc.citation.spage499en_US
dc.citation.epage506en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000423124500018en_US
Appears in Collections:Articles