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dc.contributor.authorChung, Chris Chun-Chihen_US
dc.contributor.authorShen, Chiuan-Hueien_US
dc.contributor.authorLin, Jer-Yien_US
dc.contributor.authorChin, Chun-Chiehen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.date.accessioned2018-08-21T05:53:13Z-
dc.date.available2018-08-21T05:53:13Z-
dc.date.issued2018-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2017.2780851en_US
dc.identifier.urihttp://hdl.handle.net/11536/144407-
dc.description.abstractWe had successfully suspended the vertically stacked cantilever (VSC) nanowire by two approaches: 1) inserting a SiN layer as reinforcement to sustain the gate-stack thermal budget and 2) adopting high-k metal gate low-temperature process and realizing gate-all-around structure, which shows better subthreshold characteristics. Feasibility of improving current level within the same footprint and without degrading subthreshold performance is demonstrated. Series resistance limit is pointed out as a bottle neck for current increment with respect to layers of channels. Further investigation of reducing the series resistance of VSC nanowire is needed for any future circuit integration.en_US
dc.language.isoen_USen_US
dc.subjectCantileveren_US
dc.subjecthigh-k metal gate (HKMG)en_US
dc.subjectjunctionlessen_US
dc.subjectnanowireen_US
dc.subjectseries resistanceen_US
dc.subjectvertically stackeden_US
dc.titleVertically Stacked Cantilever n-Type Poly-Si Junctionless Nanowire Transistor and Its Series Resistance Limiten_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2017.2780851en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume65en_US
dc.citation.spage756en_US
dc.citation.epage762en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000423124500056en_US
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