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dc.contributor.authorMizubayashi, Wataruen_US
dc.contributor.authorNoda, Shuichien_US
dc.contributor.authorIshikawa, Yukien_US
dc.contributor.authorNishi, Takashien_US
dc.contributor.authorKikuchi, Akioen_US
dc.contributor.authorOta, Hiroyukien_US
dc.contributor.authorSu, Ping-Hsunen_US
dc.contributor.authorLi, Yimingen_US
dc.contributor.authorSamukawa, Seijien_US
dc.contributor.authorEndo, Kazuhikoen_US
dc.date.accessioned2018-08-21T05:53:17Z-
dc.date.available2018-08-21T05:53:17Z-
dc.date.issued2017-02-01en_US
dc.identifier.issn1882-0778en_US
dc.identifier.urihttp://dx.doi.org/10.7567/APEX.10.026501en_US
dc.identifier.urihttp://hdl.handle.net/11536/144487-
dc.description.abstractWe investigated the impacts of plasma-induced damage due to UV light irradiation during etching on Ge fin fabrication and the device performance of Ge fin field-effect transistors (Ge FinFETs). UV light irradiation during etching affected the shape of the Ge fin and the surface roughness of the Ge fin sidewall. A vertical and smooth Ge fin could be fabricated by neutral beam etching without UV light irradiation. The performances of Ge FinFETs fabricated by neutral beam etching were markedly improved as compared to those of Ge FinFETs fabricated by inductively coupled plasma etching, in which the UV light has an impact. (C) 2017 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleImpacts of plasma-induced damage due to UV light irradiation during etching on Ge fin fabrication and device performance of Ge fin field-effect transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/APEX.10.026501en_US
dc.identifier.journalAPPLIED PHYSICS EXPRESSen_US
dc.citation.volume10en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000424420000001en_US
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