完整後設資料紀錄
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dc.contributor.authorHsieh, Yen-Huien_US
dc.contributor.authorHuang, Yen-Junen_US
dc.contributor.authorShih, Jian-Yuen_US
dc.contributor.authorLeu, Jihperngen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2018-08-21T05:53:17Z-
dc.date.available2018-08-21T05:53:17Z-
dc.date.issued2018-02-01en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2017.2786031en_US
dc.identifier.urihttp://hdl.handle.net/11536/144489-
dc.description.abstractA method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration.en_US
dc.language.isoen_USen_US
dc.subjectAdhesionen_US
dc.subjectheterogeneous integrationen_US
dc.subjectmetalen_US
dc.subjectpolymeren_US
dc.titleExploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interfaceen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCPMT.2017.2786031en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume8en_US
dc.citation.spage195en_US
dc.citation.epage201en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子物理學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000424515100004en_US
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