標題: Evaluation of AlGaN/GaN metal-oxide-semicondutor high-electron mobility transistors with plasma-enhanced atomic layer deposition HfO2/AlN date dielectric for RF power applications
作者: Chiu, Yu Sheng
Luc, Quang Ho
Lin, Yueh Chin
Huang, Jui Chien
Dee, Chang Fu
Majlis, Burhanuddin Yeop
Chang, Edward Yi
材料科學與工程學系
電子工程學系及電子研究所
Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Sep-2017
摘要: A plasma enhanced atomic layer deposition (PEALD) HfO2/AlN dielectric stack was used as the gate dielectric for AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) for high-frequency power device applications. The capacitance-voltage (C-V) curves of the HfO2/AlN/GaN MOS capacitor (MOSCAP) showed a small frequency dispersion along with a very small hysteresis (similar to 50 mV). Moreover, the interface trap density (D-it) was calculated to be 2.7 x 10(11)cm(-1)V(-1) s(-1) at 150 degrees C. Using PEALD-AlN as the interfacial passivation layer (IPL), the drain current of the HfO2/AlN MOS-HEMTs increased by about 46% and the gate leakage current decreased by six orders of magnitude as compared with those of the conventional Schottky gate AlGaN/GaN HEMTs processed using the same epitaxial wafer. The 0.3-mu m-gate-length HfO2/AlN/AlGaN/GaN MOS-HEMTs demonstrated a 2.88W/mm output power, a 23 dB power gain, a 30.2% power-added efficiency at 2.4 GHz, and an improved device linearity as compared with the conventional AlGaN/GaN HEMTs. The third-order intercept point at the output (OIP3) of the MOS-HEMTs was 28.4 as compared with that of 26.5 for the conventional GaN HEMTs. Overall, the MOS-HEMTs with a HfO2/AlN gate stack showed good potential for high-linearity RF power device applications. (C) 2017 The Japan Society of Applied Physics
URI: http://dx.doi.org/10.7567/JJAP.56.094101
http://hdl.handle.net/11536/144538
ISSN: 0021-4922
DOI: 10.7567/JJAP.56.094101
期刊: JAPANESE JOURNAL OF APPLIED PHYSICS
Volume: 56
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