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dc.contributor.authorSu, Ping-Hsunen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2018-08-21T05:53:24Z-
dc.date.available2018-08-21T05:53:24Z-
dc.date.issued2018-03-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2018.2791436en_US
dc.identifier.urihttp://hdl.handle.net/11536/144637-
dc.description.abstractThis research explores the electrical characteristics of the unity gain frequency (F-t) in relation to the experimental in-line process parameters of 16-nm high-kappa metal gate bulk fin-type field effect transistor devices. Because F-t is dependent on the transconductance (G(m)) and effective gate capacitance (C-gg), a sensitivity analysis of these two factors is applied to determine key in-line process parameters. The engineering results of this letter indicate that G(m) and C-gg are significantly fluctuated by six in-line process parameters, including the gate length, fin height, high-kappa/interfacial layer thickness, source/drain (S/D) proximity, S/D depth, and gate height. These six parameters fluctuate F-t at the same time, withGm as the dominant factor.en_US
dc.language.isoen_USen_US
dc.subjectIn-line process parametersen_US
dc.subjectbulk FinFETsen_US
dc.subjectunity gain frequencyen_US
dc.subjecttransconductanceen_US
dc.subjectcharacteristic fluctuationen_US
dc.titleAnalysis of In-Line Process Parameters of the Unity Gain Frequency of HKMG Bulk FinFET Devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2018.2791436en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume39en_US
dc.citation.spage335en_US
dc.citation.epage338en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000426794100002en_US
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