完整後設資料紀錄
DC 欄位語言
dc.contributor.authorKumar, Dayananden_US
dc.contributor.authorAluguri, Rakeshen_US
dc.contributor.authorChand, Umeshen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2018-08-21T05:53:36Z-
dc.date.available2018-08-21T05:53:36Z-
dc.date.issued2018-04-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.57.04FE16en_US
dc.identifier.urihttp://hdl.handle.net/11536/144915-
dc.description.abstractTa5Si3-based conductive bridge random access memory (CBRAM) devices have been investigated to improve their resistive switching characteristics for their application in future nonvolatile memory technology. Changes in the switching characteristics by the addition of a thin Al2O3 layer of different thicknesses at the bottom electrode interface of a Ta5Si3-based CBRAM devices have been studied. The double-layer device with a 1 nm Al2O3 layer has shown improved resistive switching characteristics over the single layer one with a high on/off resistance ratio of 10(2), high endurance of more than 10(4) cycles, and good retention for more than 10(5) s at the temperature of 130 degrees C. The higher thermal conductivity of Al2O3 over Ta5Si3 has been attributed to the enhanced switching properties of the double-layer devices. (C) 2018 The Japan Society of Applied Physics.en_US
dc.language.isoen_USen_US
dc.titleRole of Al2O3 thin layer on improving the resistive switching properties of Ta5Si3-based conductive bridge random accesses memory deviceen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/JJAP.57.04FE16en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume57en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000430981800066en_US
顯示於類別:期刊論文