Title: Drain-Induced-Barrier-Lowing-Like Effect Induced by Oxygen-Vacancy in Scaling-Down via-Contact Type Amorphous InGaZnO Thin-Film Transistors
Authors: Yang, Chung-I.
Chang, Ting-Chang
Liao, Po-Yung
Chen, Li-Hui
Chen, Bo-Wei
Chou, Wu-Ching
Chen, Guan-Fu
Lin, Sung-Chun
Yeh, Cheng-Yen
Tsai, Cheng-Ming
Yu, Ming-Chang
Zhang, Shengdong
電子物理學系
Department of Electrophysics
Keywords: Bottom gate TFTs;indium gallium zinc oxide (IGZO);oxygen vacancy;drain induced barrier lowing (DIBL)
Issue Date: 1-Jan-2018
Abstract: This investigation considers a method to ameliorate drain induced barrier lowing behavior in amorphous-indium-gallium-zinc-oxide thin-film transistors. The Vth is found to shift negatively when increasing the ID-VG measurement condition VD from 0.1 to 15 V. The current-voltage curves show that this degradation is caused by the effective channel length (L-eff) being shorter than the mask channel length (L). Using the transmission line method to extract Leff, we discover that the degradation will be completely suppressed by an annealing treatment. As a result, the degradation mechanism of shorter channel length a-IGZO thin film transistors is due to oxygen-vacancies which are located between the channel and the source/drain junction.
URI: http://dx.doi.org/10.1109/JEDS.2018.2837682
http://hdl.handle.net/11536/145144
ISSN: 2168-6734
DOI: 10.1109/JEDS.2018.2837682
Journal: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume: 6
Begin Page: 685
End Page: 690
Appears in Collections:Articles