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dc.contributor.authorHu, Yu-Chenen_US
dc.contributor.authorHuang, Yu-Chiehen_US
dc.contributor.authorHuang, Po-Tsangen_US
dc.contributor.authorWu, Shang-Linen_US
dc.contributor.authorChang, Hsiao-Chunen_US
dc.contributor.authorYang, Yu-Taoen_US
dc.contributor.authorYou, Yan-Hueien_US
dc.contributor.authorChen, Jr-Mingen_US
dc.contributor.authorHuang, Yan-Yuen_US
dc.contributor.authorLin, Yen-Hanen_US
dc.contributor.authorDuann, Jeng-Renen_US
dc.contributor.authorChiu, Tzai-Wenen_US
dc.contributor.authorHwang, Weien_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2018-08-21T05:53:55Z-
dc.date.available2018-08-21T05:53:55Z-
dc.date.issued2017-04-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2017.2660763en_US
dc.identifier.urihttp://hdl.handle.net/11536/145332-
dc.description.abstractIn the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature packaging and excessive noise interference bottlenecks are some of the challenges faced by the electrodes and circuit chips integration with traditional wire bonding. This paper proposes a 2.5-D heterogeneous integration neural sensing microsystem based on the silicon substrate to overcome these issues. With standard semiconductor and 3-D integration processes, high-channel-density (256 channels at 25 mm(2)) neural sensing microsystem is achieved. Through silicon via provides the shortest vertical interconnection and dramatically minimizes the packaging. Furthermore, the interposer can carry multiple chips to enhance the function of the biosensor. Electrical characteristics and reliability examinations reveal its high quality and great performance as compared to traditional approaches. This novel highly integrated neural sensing microsystem is expected to contribute to the biomedical field for exploring and solving unknown biological mysteries.en_US
dc.language.isoen_USen_US
dc.subjectmu-probesen_US
dc.subjectMEMSen_US
dc.subjectbiosensoren_US
dc.subjectneural sensing microsystemen_US
dc.subjectthrough silicon via (TSV)en_US
dc.subject2.5-D heterogeneous integrationen_US
dc.titleAn Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystemen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2017.2660763en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume64en_US
dc.citation.spage1666en_US
dc.citation.epage1673en_US
dc.contributor.department生物科技學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentDepartment of Biological Science and Technologyen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:000398818400039en_US
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