完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hu, Yu-Chen | en_US |
dc.contributor.author | Huang, Yu-Chieh | en_US |
dc.contributor.author | Huang, Po-Tsang | en_US |
dc.contributor.author | Wu, Shang-Lin | en_US |
dc.contributor.author | Chang, Hsiao-Chun | en_US |
dc.contributor.author | Yang, Yu-Tao | en_US |
dc.contributor.author | You, Yan-Huei | en_US |
dc.contributor.author | Chen, Jr-Ming | en_US |
dc.contributor.author | Huang, Yan-Yu | en_US |
dc.contributor.author | Lin, Yen-Han | en_US |
dc.contributor.author | Duann, Jeng-Ren | en_US |
dc.contributor.author | Chiu, Tzai-Wen | en_US |
dc.contributor.author | Hwang, Wei | en_US |
dc.contributor.author | Chuang, Ching-Te | en_US |
dc.contributor.author | Chiou, Jin-Chern | en_US |
dc.contributor.author | Chen, Kuan-Neng | en_US |
dc.date.accessioned | 2018-08-21T05:53:55Z | - |
dc.date.available | 2018-08-21T05:53:55Z | - |
dc.date.issued | 2017-04-01 | en_US |
dc.identifier.issn | 0018-9383 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TED.2017.2660763 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/145332 | - |
dc.description.abstract | In the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature packaging and excessive noise interference bottlenecks are some of the challenges faced by the electrodes and circuit chips integration with traditional wire bonding. This paper proposes a 2.5-D heterogeneous integration neural sensing microsystem based on the silicon substrate to overcome these issues. With standard semiconductor and 3-D integration processes, high-channel-density (256 channels at 25 mm(2)) neural sensing microsystem is achieved. Through silicon via provides the shortest vertical interconnection and dramatically minimizes the packaging. Furthermore, the interposer can carry multiple chips to enhance the function of the biosensor. Electrical characteristics and reliability examinations reveal its high quality and great performance as compared to traditional approaches. This novel highly integrated neural sensing microsystem is expected to contribute to the biomedical field for exploring and solving unknown biological mysteries. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | mu-probes | en_US |
dc.subject | MEMS | en_US |
dc.subject | biosensor | en_US |
dc.subject | neural sensing microsystem | en_US |
dc.subject | through silicon via (TSV) | en_US |
dc.subject | 2.5-D heterogeneous integration | en_US |
dc.title | An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TED.2017.2660763 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | en_US |
dc.citation.volume | 64 | en_US |
dc.citation.spage | 1666 | en_US |
dc.citation.epage | 1673 | en_US |
dc.contributor.department | 生物科技學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | 電控工程研究所 | zh_TW |
dc.contributor.department | Department of Biological Science and Technology | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.contributor.department | Institute of Electrical and Control Engineering | en_US |
dc.identifier.wosnumber | WOS:000398818400039 | en_US |
顯示於類別: | 期刊論文 |