Title: The effect of device electrode geometry on performance after hot-carrier stress in amorphous In-Ga-Zn-O thin film transistors with different via-contact structures
Authors: Liao, Po-Yung
Chang, Ting-Chang
Chen, Yu-Jia
Su, Wan-Ching
Chen, Bo-Wei
Chen, Li-Hui
Hsieh, Tien-Yu
Yang, Chung-Yi
Chang, Kuan-Chang
Zhang, Sheng-Dong
Huang, Yen-Yu
Chang, Hsi-Ming
Chiang, Shin-Chuan
電子物理學系
Department of Electrophysics
Issue Date: 15-May-2017
Abstract: In this letter, the effects of hot carriers on amorphous In-Ga-Zn-O thin film transistors (TFTs) of different geometric structures were investigated. Three types of via-contact structure TFTs are used in this experiment, defined as source-drain large (SD large), source-drain normal (SD normal), and fork-shaped. After hot-carrier stress, the I-V curves of both SD normal and fork-shaped TFTs with U-shaped drains show a threshold voltage shift along with the parasitic transistor characteristic in the reverse-operation mode. Asymmetrical degradation is exhibited in an ISE-TCAD simulation of the electric field, which shows the distribution of hot electrons injected into the etch-stop layer below the redundant drain electrode. Published by AIP Publishing.
URI: http://dx.doi.org/10.1063/1.4983713
http://hdl.handle.net/11536/145571
ISSN: 0003-6951
DOI: 10.1063/1.4983713
Journal: APPLIED PHYSICS LETTERS
Volume: 110
Appears in Collections:Articles