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dc.contributor.authorDu, Xiaoqinen_US
dc.contributor.authorWu, Xiaojingen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorPan, Chih-Hungen_US
dc.contributor.authorWu, Cheng-Hsienen_US
dc.contributor.authorLin, Yu-Shuoen_US
dc.contributor.authorChen, Po-Hsunen_US
dc.contributor.authorZhang, Shengdongen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2018-08-21T05:54:06Z-
dc.date.available2018-08-21T05:54:06Z-
dc.date.issued2017-06-01en_US
dc.identifier.issn1882-0778en_US
dc.identifier.urihttp://dx.doi.org/10.7567/APEX.10.064001en_US
dc.identifier.urihttp://hdl.handle.net/11536/145586-
dc.description.abstractThe successful recovery of resistive switching random access memory (RRAM) devices that have undergone switching failure is achieved by introducing a low-temperature supercritical-fluid process that passivates the switching layer. These failed RRAM devices, which are incapable of switching between high-and low-resistance states, were treated with supercritical carbon dioxide with pure water at 120 degrees C for 1 h. After the treatment, the devices became operational again and showed excellent current-voltage (I-V) characteristics and reliability as before. On the basis of the current conduction mechanism fitting results, we propose a model to explain the phenomenon. (C) 2017 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleRecovery of failed resistive switching random access memory devices by a low-temperature supercritical treatmenten_US
dc.typeArticleen_US
dc.identifier.doi10.7567/APEX.10.064001en_US
dc.identifier.journalAPPLIED PHYSICS EXPRESSen_US
dc.citation.volume10en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000402558600001en_US
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