完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, Ming-Li | en_US |
dc.contributor.author | Wang, Shin-Yuan | en_US |
dc.contributor.author | Chien, Chao-Hsin | en_US |
dc.date.accessioned | 2018-08-21T05:54:20Z | - |
dc.date.available | 2018-08-21T05:54:20Z | - |
dc.date.issued | 2017-08-01 | en_US |
dc.identifier.issn | 1882-0778 | en_US |
dc.identifier.uri | http://dx.doi.org/10.7567/APEX.10.086501 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/145821 | - |
dc.description.abstract | Through in situ hydrogen plasma treatment (HPT) and plasma-enhanced atomic-layer-deposited TiN (PEALD-TiN) layer capping, we successfully fabricated TiN/HfO2/GaSb metal-oxide-semiconductor capacitors with an ultrathin equivalent oxide thickness of 0.66nm and a low density of states of approximately 2 x 10(12)cm(-2) eV(-1) near the valence band edge. After in situ HPT, a native oxide-free surface was obtained through efficient etching. Moreover, the use of the in situ PEALD-TiN layer precluded high-. dielectric damage that would have been caused by conventional sputtering, thereby yielding a superior high-. dielectric and low gate leakage current. (C) 2017 The Japan Society of Applied Physics | en_US |
dc.language.iso | en_US | en_US |
dc.title | Highly scaled equivalent oxide thickness of 0.66nm for TiN/HfO2/GaSb MOS capacitors by using plasma-enhanced atomic layer deposition | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.7567/APEX.10.086501 | en_US |
dc.identifier.journal | APPLIED PHYSICS EXPRESS | en_US |
dc.citation.volume | 10 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000406108200001 | en_US |
顯示於類別: | 期刊論文 |