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dc.contributor.authorLee, Wei-Lien_US
dc.contributor.authorHsu, Chung-Chunen_US
dc.contributor.authorChung, Cheng-Tingen_US
dc.contributor.authorLu, Yu-Hungen_US
dc.contributor.authorLuo, Guang-Lien_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.date.accessioned2018-08-21T05:54:30Z-
dc.date.available2018-08-21T05:54:30Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0101708jssen_US
dc.identifier.urihttp://hdl.handle.net/11536/146045-
dc.description.abstractWe fabricated a Ge junctionless p-channel metal-oxide-semiconductor field-effect transistor (JL pMOSFET) with a raised metal source/drain (S/D) composed of a metal alloy. An ultrathin-body Ge channel was trimmed to 10 nm, which is lower than the maximum depletion width, to completely switch off the device. The fabricated Ge JL pMOSFET containing a raised Ni/NiGe S/D exhibited a high on/off current ratio (I-on/I-off) value (approximately 10(5) at V-DS =-0.1 V). The S/D series resistance of the full metal S/D structure was exactly lower than the structures of Ge/NiGe and Ge bulk S/D. Synopsys Technology Computer-Aided Design tools were used to confirm the advantages of the full metal S/D structure and demonstrate the enhancement of the S/D resistance in a device with scaled gate length. The proposed scheme is suitable for reducing the series resistance of a device with minimized dimensions. (C) 2017 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleFully Depleted GeOI-Channel Junctionless pMOSFET with a Low-Resistance-Raised NiGe Alloy S/Den_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0101708jssen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.volume6en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000409883900016en_US
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