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dc.contributor.authorChen, Po-Chunen_US
dc.contributor.authorChiu, Yu-Chienen_US
dc.contributor.authorZheng, Zhi-Weien_US
dc.contributor.authorLin, Ming-Hueien_US
dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorLiou, Guan-Linen_US
dc.contributor.authorHsu, Hsiao-Hsuanen_US
dc.contributor.authorKao, Hsuan-lingen_US
dc.date.accessioned2018-08-21T05:54:30Z-
dc.date.available2018-08-21T05:54:30Z-
dc.date.issued2017-09-01en_US
dc.identifier.issn1536-125Xen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TNANO.2017.2719946en_US
dc.identifier.urihttp://hdl.handle.net/11536/146051-
dc.description.abstractIn this study, we demonstrated a p-type and n-type SnO TFTs on flexible polyimide substrate. The fabricated p-type SnO TFT showed a high I-on/I-off of 5.7 x 10(5) and a high mu(FE) of 10.7 cm(2) V-1 s(-1). Through optimizing the oxygen plasma condition, the n-type channel TFT transfered from prime p-type channel exhibits excellent characteristics, including a high on/off current ratio of 6.6 x 10(3), a low threshold voltage of -0.13 V, and a very high field-effect mobility of 28 cm(2) V-1 s(-1). This proposed low-temperature oxygen plasma treatment shows the potential in simplification of TFT process that can achieve n-type and p-type TFTs under the same device process.en_US
dc.language.isoen_USen_US
dc.subjectFlexible substrateen_US
dc.subjectplasmaen_US
dc.subjecttin oxide (SnO)en_US
dc.subjectthin-film transistor (TFT)en_US
dc.titleFast Low-Temperature Plasma Process for the Application of Flexible Tin-Oxide-Channel Thin Film Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TNANO.2017.2719946en_US
dc.identifier.journalIEEE TRANSACTIONS ON NANOTECHNOLOGYen_US
dc.citation.volume16en_US
dc.citation.spage876en_US
dc.citation.epage879en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000410170500023en_US
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