完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Liao, Chan-Yu | en_US |
dc.contributor.author | Lin, Hsiao-Chun | en_US |
dc.contributor.author | Wang, Chao-Lung | en_US |
dc.contributor.author | Lee, I-Che | en_US |
dc.contributor.author | Chou, Chia-Hsin | en_US |
dc.contributor.author | Li, Yu-Ren | en_US |
dc.contributor.author | Cheng, Huang-Chung | en_US |
dc.date.accessioned | 2018-08-21T05:54:31Z | - |
dc.date.available | 2018-08-21T05:54:31Z | - |
dc.date.issued | 2017-10-01 | en_US |
dc.identifier.issn | 0960-1317 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1088/1361-6439/aa849e | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/146062 | - |
dc.description.abstract | This paper reports the demonstration of structural effects on excimer laser crystallization (ELC) for the Si strip with a recessed-channel structure on the silicon nitride under-layer (RCS-ULN). We revealed that a single location-controlled grain boundary (GB) oriented normal to the Si strip in the middle site without any other GB in the recessed region can be attained via ELC for the RCS-ULN structures with a short recessed region between neighboring long thick regions in a narrow Si strip. This can be attributed to the effective production of a significant 2D lateral thermal gradient in the recessed region and neighboring thick regions. Consequently, the RCS-ULN TFTs fabricated at the position one-half of such an optimal recessed region can achieve a superior field-effect mobility of 670 cm(2) V-1 . s(-1) with minor performance variations since the single-crystal-like Si channel has been adopted. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | excimer laser crystallization (ELC) | en_US |
dc.subject | light absorption layer | en_US |
dc.subject | location-controlled grain boundary | en_US |
dc.subject | polycrystalline silicon (poly-Si) | en_US |
dc.subject | thin-film transistor (TFT) | en_US |
dc.title | Formation and characterization of high-performance silicon thin-film transistors with and without location-controlled grain boundary | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1088/1361-6439/aa849e | en_US |
dc.identifier.journal | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | en_US |
dc.citation.volume | 27 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000410615100002 | en_US |
顯示於類別: | 期刊論文 |