完整後設資料紀錄
DC 欄位語言
dc.contributor.authorGan, Kai-jhihen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorChien, Ta-Chunen_US
dc.contributor.authorRuan, Dun-Baoen_US
dc.contributor.authorChiu, Yu-Chuanen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2018-08-21T05:56:29Z-
dc.date.available2018-08-21T05:56:29Z-
dc.date.issued2018-01-01en_US
dc.identifier.issn2378-8593en_US
dc.identifier.urihttp://hdl.handle.net/11536/146242-
dc.description.abstractWe study the influence of post-deposition annealing on the electrical properties of performance of Ga2O3-based Cu-ion-based conductive-bridge RAM (CBRAM) devices. Amorphous gallium oxide (Ga2O3) thin films were fabricated by RF sputtering at room temperature. The deposited films were annealed from the different temperatures and gas ambient. Their resistive switching characteristics are compared to determine the role of temperature and atmosphere in the annealing process on performance of these memory devices. The substantial improvement in device performance, such as stable switching, high switching cycles, and increased memory window, were obtained in the CBRAM devices during the post-Ga2O3 deposition annealing in pure nitrogen (N-2) ambient.en_US
dc.language.isoen_USen_US
dc.subjectGa2O3en_US
dc.subjectCBRAMen_US
dc.subjectAnnealingen_US
dc.titleImpact of Post Deposition Annealing on Resistive Switching in Ga2O3-Based Conductive-Bridge RAM Devicesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2018 7TH IEEE INTERNATIONAL SYMPOSIUM ON NEXT-GENERATION ELECTRONICS (ISNE)en_US
dc.citation.spage281en_US
dc.citation.epage282en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000438498600081en_US
顯示於類別:會議論文