Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Ko, Cheng-Ta	en_US
dc.contributor.author	Yang, Kai-Ming	en_US
dc.contributor.author	Lin, Jim-Wein	en_US
dc.contributor.author	Wang, Chih-Lun	en_US
dc.contributor.author	Chou, Tzu-Chieh	en_US
dc.contributor.author	Yang, Yu-Tao	en_US
dc.contributor.author	Yu, Ting-Yang	en_US
dc.contributor.author	Chen, Yu-Hua	en_US
dc.contributor.author	Chen, Kuan-Neng	en_US
dc.contributor.author	Tseng, Tzyy-Jang	en_US
dc.date.accessioned	2018-08-21T05:56:49Z	-
dc.date.available	2018-08-21T05:56:49Z	-
dc.date.issued	2017-01-01	en_US
dc.identifier.uri	http://hdl.handle.net/11536/146684	-
dc.description.abstract	In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).	en_US
dc.language.iso	en_US	en_US
dc.title	Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)	en_US
dc.citation.spage	18	en_US
dc.citation.epage	18	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000404249700018	en_US
顯示於類別：	會議論文