Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng

Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

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2019-01-01

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In this paper, low temperature (190-220 degrees C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP).

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https://ir.lib.nycu.edu.tw/handle/11536/153257

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會議論文;;Conferences Paper

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Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

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