標題: Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
作者: Juang, Jing-Ye
Chu, Yi-Cheng
Lu, Chia-Ling
Chen, Chih
Tu, King-Ning
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-Jan-2017
摘要: In this study, a low temperature solid state diffusion bonding process with (111) highly oriented nano-twined Cu (nt-Cu) was proposed. A less void bonding interface was observed reveals a good bonding quality for the bonded samples. In addition, a large quasisingle grain was identified in the bonded film. Based on these results, it is believed that high strength and durable bonding structure can be accomplished by bonding two highly (111)-oriented nt-Cu films.
URI: http://hdl.handle.net/11536/146685
期刊: 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)
起始頁: 32
結束頁: 32
Appears in Collections:Conferences Paper