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dc.contributor.authorChen, Jie-Tingen_US
dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorChang, Rong-Kunen_US
dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorTzeng, Tzu-Chienen_US
dc.contributor.authorLin, Tzu-Chiangen_US
dc.date.accessioned2018-08-21T05:56:49Z-
dc.date.available2018-08-21T05:56:49Z-
dc.date.issued2016-01-01en_US
dc.identifier.issn1548-3746en_US
dc.identifier.urihttp://hdl.handle.net/11536/146687-
dc.description.abstractTo prevent from electrostatic discharge (ESD) damages, the ESD protection design must be added on chip. The ESD protection design with low parasitic capacitance is needed for high-speed applications. In this work, an ESD protection design realized by stacked diodes with embedded silicon-controlled rectifier was proposed. Verified in silicon chip, the proposed ESD protection design with lower parasitic capacitance and higher ESD robustness was more suitable for high-speed ESD protection in CMOS technology.en_US
dc.language.isoen_USen_US
dc.titleESD Protection Design for High-Speed Applications in CMOS Technologyen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 IEEE 59TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS)en_US
dc.citation.spage305en_US
dc.citation.epage308en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000404343800077en_US
Appears in Collections:Conferences Paper