Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chen, Jie-Ting | en_US |
| dc.contributor.author | Lin, Chun-Yu | en_US |
| dc.contributor.author | Chang, Rong-Kun | en_US |
| dc.contributor.author | Ker, Ming-Dou | en_US |
| dc.contributor.author | Tzeng, Tzu-Chien | en_US |
| dc.contributor.author | Lin, Tzu-Chiang | en_US |
| dc.date.accessioned | 2018-08-21T05:56:49Z | - |
| dc.date.available | 2018-08-21T05:56:49Z | - |
| dc.date.issued | 2016-01-01 | en_US |
| dc.identifier.issn | 1548-3746 | en_US |
| dc.identifier.uri | http://hdl.handle.net/11536/146687 | - |
| dc.description.abstract | To prevent from electrostatic discharge (ESD) damages, the ESD protection design must be added on chip. The ESD protection design with low parasitic capacitance is needed for high-speed applications. In this work, an ESD protection design realized by stacked diodes with embedded silicon-controlled rectifier was proposed. Verified in silicon chip, the proposed ESD protection design with lower parasitic capacitance and higher ESD robustness was more suitable for high-speed ESD protection in CMOS technology. | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | ESD Protection Design for High-Speed Applications in CMOS Technology | en_US |
| dc.type | Proceedings Paper | en_US |
| dc.identifier.journal | 2016 IEEE 59TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | en_US |
| dc.citation.spage | 305 | en_US |
| dc.citation.epage | 308 | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.identifier.wosnumber | WOS:000404343800077 | en_US |
| Appears in Collections: | Conferences Paper | |

