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dc.contributor.authorChang, Shyh-Mingen_US
dc.contributor.authorKao, Kuo-Shuen_US
dc.contributor.authorAn, Chao-Chyunen_US
dc.contributor.authorChen, Ming-Yaoen_US
dc.contributor.authorTsang, Jimmyen_US
dc.contributor.authorYang, Sheng-Shuen_US
dc.contributor.authorChen, Chihen_US
dc.contributor.authorLin, Chung-Kuangen_US
dc.contributor.authorChen, Wen-Chihen_US
dc.date.accessioned2018-08-21T05:56:58Z-
dc.date.available2018-08-21T05:56:58Z-
dc.date.issued2007-01-01en_US
dc.identifier.urihttp://hdl.handle.net/11536/146877-
dc.description.abstractNon-Conductive-Film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low as well as stable connection resistance at various environmental temperatures.en_US
dc.language.isoen_USen_US
dc.titleThe brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCDen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIDMC'07: PROCEEDINGS OF THE INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE 2007en_US
dc.citation.spage413en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000258177700106en_US
Appears in Collections:Conferences Paper