标题: Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
作者: Yang, Yu-Tao
Yu, Ting-Yang
Kuo, Shu-Chiao
Huang, Tai-Yuan
Yang, Kai-Ming
Ko, Cheng-Ta
Chen, Yu-Hua
Tseng, Tzyy-Jang
Chen, Kuan-Neng
电子工程学系及电子研究所
Department of Electronics Engineering and Institute of Electronics
关键字: simulation;Cu-Cu direct bonding;hetrogeneous integration
公开日期: 1-一月-2017
摘要: In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure are all considered in simulation. In addition, pillarconcave bonding is successfully demonstrated on silicon substrates with bonding temperatures ranging from 60 degrees C to 100 degrees C. Simulation and fabrication results of concept show potential impacts on current semiconductor packaging method with advantages such as high adhesive strength of polymer on various types of substrates, simplified manufacturing process, solder free interconnect and packaging process, Cu-Cu direct bonding at temperature lower than 100 degrees C, and high tolerance in surface roughness.
URI: http://dx.doi.org/10.1109/ECTC.2017.9
http://hdl.handle.net/11536/146896
ISSN: 0569-5503
DOI: 10.1109/ECTC.2017.9
期刊: 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
起始页: 637
结束页: 642
显示于类别:Conferences Paper