标题: | Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration |
作者: | Yang, Yu-Tao Yu, Ting-Yang Kuo, Shu-Chiao Huang, Tai-Yuan Yang, Kai-Ming Ko, Cheng-Ta Chen, Yu-Hua Tseng, Tzyy-Jang Chen, Kuan-Neng 电子工程学系及电子研究所 Department of Electronics Engineering and Institute of Electronics |
关键字: | simulation;Cu-Cu direct bonding;hetrogeneous integration |
公开日期: | 1-一月-2017 |
摘要: | In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure are all considered in simulation. In addition, pillarconcave bonding is successfully demonstrated on silicon substrates with bonding temperatures ranging from 60 degrees C to 100 degrees C. Simulation and fabrication results of concept show potential impacts on current semiconductor packaging method with advantages such as high adhesive strength of polymer on various types of substrates, simplified manufacturing process, solder free interconnect and packaging process, Cu-Cu direct bonding at temperature lower than 100 degrees C, and high tolerance in surface roughness. |
URI: | http://dx.doi.org/10.1109/ECTC.2017.9 http://hdl.handle.net/11536/146896 |
ISSN: | 0569-5503 |
DOI: | 10.1109/ECTC.2017.9 |
期刊: | 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) |
起始页: | 637 |
结束页: | 642 |
显示于类别: | Conferences Paper |