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dc.contributor.authorChiu, Wei-Lunen_US
dc.contributor.authorJiang, Iris Hui-Ruen_US
dc.contributor.authorLu, Chien-Pangen_US
dc.contributor.authorChang, Yu-Tungen_US
dc.date.accessioned2018-08-21T05:57:00Z-
dc.date.available2018-08-21T05:57:00Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn0738-100Xen_US
dc.identifier.urihttp://dx.doi.org/10.1145/3061639.3062303en_US
dc.identifier.urihttp://hdl.handle.net/11536/146928-
dc.description.abstractHold time fixing ensures correct data synchronization, which is essential and serves as the final step of timing closure for IC design. Conventionally, buffer insertion is adopted to fix hold time violations; buffers, however, induce routing difficulty, increase area utilization, and contribute leakage power. Therefore, in this paper, we propose to fix hold time violations by free metal segment allocation for achieving leakage power efficiency and maintaining utilization for mobile and portable devices. At the final step of timing closure, free metal segments and hold violating nets are both fragmented and scattered over the design. We thus partition a design and perform minimum cost network flow to assign proper free metal segments to hold violating nets. Our experiments are conducted on six industrial smartphone designs with TSMC 16nm process, and our results show that compared with the conventional buffer insertion method, our approach can reduce 37% hold time buffer area, promising for saving leakage power and maintaining area utilization-suited to the final step of timing closure.en_US
dc.language.isoen_USen_US
dc.subjectTiming closureen_US
dc.subjecthold time fixingen_US
dc.subjectfree metal segmentsen_US
dc.titlePower and Area Efficient Hold Time Fixing by Free Metal Segment Allocationen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1145/3061639.3062303en_US
dc.identifier.journalPROCEEDINGS OF THE 2017 54TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000424895400152en_US
Appears in Collections:Conferences Paper