標題: | Enhancement of CMOS THz Imaging Sensing By Packaging Technology |
作者: | Kuo, Chien-Nan Chen, Wei-Cheng Chiu, Te-Yen Li, Chun-Hsing 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | CMOS;THz;imaging system;3D;switch;dielectric resonator |
公開日期: | 1-一月-2017 |
摘要: | Terahertz imaging sensing provides numerous attractive applications in different areas, for example, biology and medicine. CMOS technology benefits an imaging system in low cost and a small form factor. The technology advance is technically viable for circuit design in such high frequencies. Lossy silicon substrate, however, still degrades system performance. We will discuss the techniques of performance enhancement. |
URI: | http://hdl.handle.net/11536/147069 |
期刊: | 2017 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT) |
起始頁: | 22 |
結束頁: | 24 |
顯示於類別: | 會議論文 |