完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorQuang-Ho Lucen_US
dc.contributor.authorHuy-Binh Doen_US
dc.contributor.authorLin, Yueh-Chinen_US
dc.date.accessioned2018-08-21T05:57:08Z-
dc.date.available2018-08-21T05:57:08Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn2162-7541en_US
dc.identifier.urihttp://hdl.handle.net/11536/147096-
dc.description.abstractA marked improvement in the performance and reliability of In0.53Ga0.47As FinFETs have been demonstrated by applying an in situ remote-plasma gas (PRP) treatment. Under nitrogen passivation effects, an excellent immunity to short channel effects (SCEs) is shown for the scaled In0.53Ga0.47As FinFETs. The positive bias temperature instability (PBTI) measurements indicate that the NH3 plasma-treated In0.53Ga0.47As FinFETs are quite reliable with a small threshold voltage shift and a long-term operation. These results suggest that the in situ PRP treatment could be a key process for high-k dielectric technology for the sub-nanometer III-V MOS related devices.en_US
dc.language.isoen_USen_US
dc.titlePerformance Improvement of InGaAs FinFET Using NH3 Treatmenten_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE 12TH INTERNATIONAL CONFERENCE ON ASIC (ASICON)en_US
dc.citation.spage577en_US
dc.citation.epage579en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department國際半導體學院zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInternational College of Semiconductor Technologyen_US
dc.identifier.wosnumberWOS:000426983400145en_US
顯示於類別:會議論文