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dc.contributor.authorSu, Po-Chengen_US
dc.contributor.authorJiang, Cheng-Minen_US
dc.contributor.authorWang, Chih-Weien_US
dc.contributor.authorWang, Tahuien_US
dc.date.accessioned2019-04-02T05:59:54Z-
dc.date.available2019-04-02T05:59:54Z-
dc.date.issued2018-11-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2018.2868472en_US
dc.identifier.urihttp://hdl.handle.net/11536/148373-
dc.description.abstractWe characterize SET-state current degradation induced by read operations in a tungsten oxide resistive memory cell. The current degradation exhibits a two-stage evolution. In the second stage, the current decline follows inverse power-law dependence on cumulative read-disturb time. We present an analytical model to derive the inverse power law. Our model includes oxygen ion activation, mobile oxygen ion hopping, and the reduction of oxygen vacancy density by re-oxidation. Voltage and temperature effects on read-disturb-induced degradation are characterized for comparison with the model. Our results show that the power factor in the inverse power law has exponential dependence on a read voltage.en_US
dc.language.isoen_USen_US
dc.subjectResistive memoryen_US
dc.subjectread-disturben_US
dc.subjectanalytical modelen_US
dc.titleModeling of Read-Disturb-Induced SET-State Current Degradation in a Tungsten Oxide Resistive Switching Memoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2018.2868472en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume39en_US
dc.citation.spage1648en_US
dc.citation.epage1651en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000448539100006en_US
dc.citation.woscount0en_US
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