完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Wu, YH | en_US |
dc.contributor.author | Chen, WJ | en_US |
dc.contributor.author | Chang, SL | en_US |
dc.contributor.author | Chin, A | en_US |
dc.contributor.author | Gwo, S | en_US |
dc.contributor.author | Tsai, C | en_US |
dc.date.accessioned | 2019-04-02T05:58:43Z | - |
dc.date.available | 2019-04-02T05:58:43Z | - |
dc.date.issued | 1999-05-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/55.761014 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/148379 | - |
dc.description.abstract | We have developed a simple process to form epitaxial CoSi2 for shallow junction. Prior to metal deposition, the patterned wafers were treated with HF-vapor passivation. As observed by scanning tunneling microscopy (STM), this HF, treatment drastically improves the native oxide-induced sur face roughness. The epitaxial behavior was confirmed by cross-sectional transmission electron microscopy (TEM), Decreased sheet resistance and leakage current, and improved thermal stability are displayed by the HF treated samples, which is consistent with STM and TEM results. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Improved electrical characteristics of CoSi2 using HF-vapor pretreatment | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/55.761014 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 20 | en_US |
dc.citation.spage | 200 | en_US |
dc.citation.epage | 202 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000080066700003 | en_US |
dc.citation.woscount | 12 | en_US |
顯示於類別: | 期刊論文 |