標題: Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
作者: Wu, John A.
Huang, Chih-Yang
Wu, Wen-Wei
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: gold;nanotwin;preferred orientation;electrodeposition;bonding
公開日期: 1-十一月-2018
摘要: We reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I-(111)/I-(220) and I-(111)/I-(200) in X-ray diffraction signals indicates a strong (111) preferred orientation. Using the advantage of the fast surface diffusion of (111) plane compared to the other planes of gold, we performed direct bonding with different thicknesses. Grain growth was observed over two films' interfaces to eliminate the bonding interface, when annealed at 250 degrees C for 1 h. Shear tests were performed to gain insight on the bonding quality. All the chips failed at either the silicon substrate or substrate-adhesion layer, showing possible higher strength than the tested maximum, 40.8 MPa.
URI: http://dx.doi.org/10.3390/ma11112287
http://hdl.handle.net/11536/148536
ISSN: 1996-1944
DOI: 10.3390/ma11112287
期刊: MATERIALS
Volume: 11
顯示於類別:期刊論文


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