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dc.contributor.authorKer, MDen_US
dc.contributor.authorWu, CYen_US
dc.contributor.authorCheng, Ten_US
dc.contributor.authorChang, HHen_US
dc.date.accessioned2019-04-02T05:58:32Z-
dc.date.available2019-04-02T05:58:32Z-
dc.date.issued1996-09-01en_US
dc.identifier.issn1063-8210en_US
dc.identifier.urihttp://dx.doi.org/10.1109/92.532032en_US
dc.identifier.urihttp://hdl.handle.net/11536/149286-
dc.description.abstractCapacitor-couple technique used to lower snapback-trigger voltage and to ensure uniform ESD current distribution in deep-submicron CMOS on-chip ESD protection circuit is proposed, The coupling capacitor is realized by a poly layer right under the wire-bonding metal pad without increasing extra layout area to the pad. A timing-original design model has been derived to calculate the capacitor-couple efficiency of this proposed ESD protection circuit, Using this capacitor-couple ESD protection circuit, the thinner gate oxide of CMOS devices in deep-submicron low-voltage CMOS ASIC can be effectively protected.en_US
dc.language.isoen_USen_US
dc.titleCapacitor-couple ESD protection circuit for deep-submicron low-voltage CMOS ASICen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/92.532032en_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.citation.volume4en_US
dc.citation.spage307en_US
dc.citation.epage321en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996VE01800002en_US
dc.citation.woscount42en_US
Appears in Collections:Articles