完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChuang, HFen_US
dc.contributor.authorLee, CPen_US
dc.contributor.authorTsang, JSen_US
dc.contributor.authorFan, JCen_US
dc.date.accessioned2019-04-02T05:58:32Z-
dc.date.available2019-04-02T05:58:32Z-
dc.date.issued1996-09-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.363141en_US
dc.identifier.urihttp://hdl.handle.net/11536/149289-
dc.description.abstractPd/AlxGa1-xAs Schottky contacts and their thermal reactions are studied by capacitance-voltage measurements, current-voltage measurements, and x-ray diffraction. The thickness of AlxGa1-xAs consumed by the Pd/AlxGa1-xAs reaction during annealing was calculated. For annealing temperatures below 300 degrees C the Schottky characteristics of the diodes were good but the electrical junction moves into AlxGa1-xAs after annealing. The amount of junction movement was calculated directly from our measurements. The diffusion coefficients of Pd in AlxGa1-xAs and the activation energy were estimated. The activation energy was found to be larger for higher Al concentration. PdAl, PdAs2, PdGa5, and Pd5Ga2 were detected in the compounds formed by the Pd/AlxGa1-xAs reaction after annealing. (C) 1996 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleThermal reactions of Pd/AlxGa1-xAs contactsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.363141en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume80en_US
dc.citation.spage2891en_US
dc.citation.epage2895en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996VE24600046en_US
dc.citation.woscount3en_US
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