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dc.contributor.authorChen, YAen_US
dc.contributor.authorChiou, CFen_US
dc.contributor.authorTsay, WCen_US
dc.contributor.authorLaih, LHen_US
dc.contributor.authorHong, JWen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2019-04-02T05:59:48Z-
dc.date.available2019-04-02T05:59:48Z-
dc.date.issued1997-09-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://hdl.handle.net/11536/149610-
dc.description.abstractThe graded-gap a-SiC:II-based p-i-n thin-film light-emitting diodes (TFLED's) with an additional low-resistance and high-reflectance n(+)-a-SiCGe:H layer mere proposed and fabricated on indium-tin-oxide (ITO)-coated glass substrate in this paper. For a finished TFLED, a brightness of 720 cd/m(2) could be obtained at an injection current density of 600 mA/cm(2), and its EL (electroluminescence) threshold voltage was lowered to 8.6 V. in addition, the effects of reflectance and resistance of a-SiCGe:H film an the performance of TFLED were discussed, The optimum rapid thermal annealing (RTA) conditions for fabrication of TFLED after metallization were also studied and employed to improve the optoelectronic characteristics of TFLED.en_US
dc.language.isoen_USen_US
dc.titleOptoelectronic characteristics of alpha-SiC:H-based P-I-N thin-film light-emitting diodes with low-resistance and high-reflectance N+-alpha-SiCGe:H layeren_US
dc.typeArticleen_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume44en_US
dc.citation.spage1360en_US
dc.citation.epage1366en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997XR10800003en_US
dc.citation.woscount22en_US
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