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dc.contributor.authorLee, Yea-Chenen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.contributor.authorLee, Chia-Enen_US
dc.contributor.authorLu, Tien-Changen_US
dc.contributor.authorWang, Shing-Chungen_US
dc.date.accessioned2019-04-02T06:00:56Z-
dc.date.available2019-04-02T06:00:56Z-
dc.date.issued2008-11-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2008.2005507en_US
dc.identifier.urihttp://hdl.handle.net/11536/149701-
dc.description.abstractAlGaInP-based flip-chip light-emitting diodes (LEDs) with geometric sapphire shaping structures were fabricated by sapphire chemical etching and glue-bonded techniques. Furthermore, a nanoscale rough texture was applied on the epiwafer surface. This novel structure improved the output light power, wall-plug efficiency, and reliability. The output power of this structure was enhanced 31.2% under 350-mA current injection as compared with the conventional AlGaInP flip-chip LEDs.en_US
dc.language.isoen_USen_US
dc.subjectAlGaInP-based light-emitting diodes (LEDs)en_US
dc.subjectgeometric sapphire shaping flip-chip light-emitting diodes (GSSFC-LEDs)en_US
dc.titleHigh-Performance (AlxGa1-x)(0.5)In0.5P-Based Flip-Chip Light-Emitting Diode With a Geometric Sapphire Shaping Structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2008.2005507en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume20en_US
dc.citation.spage1950en_US
dc.citation.epage1952en_US
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:000261847800065en_US
dc.citation.woscount3en_US
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