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dc.contributor.authorHuang, Chun-Chaoen_US
dc.contributor.authorHsu, Hao-Chunen_US
dc.contributor.authorTseng, Yuan-Chiehen_US
dc.date.accessioned2014-12-08T15:21:04Z-
dc.date.available2014-12-08T15:21:04Z-
dc.date.issued2011-11-30en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2011.09.025en_US
dc.identifier.urihttp://hdl.handle.net/11536/14979-
dc.description.abstractNiP thin films were deposited on an H(3)PO(4)-etched Si substrate by means of electroless-plating. By varying the plating time, we were able to deposit NiP films with various thicknesses. Thickness effects upon the structural morphology and magnetic properties of the NiP films were investigated, and they can be comprehended with a model of the deposition mechanism. The results demonstrate that the etched Si surface contained groove-like microstructure which shaped the columnar structure inside the NiP films and favored the film deposition; this was hard to achieve with a smooth-surfaced Si substrate. The well-developed columnar structure resulted in a perpendicular anisotropy due to its vertical nature, which can become superior to the film's longitudinal anisotropy if the applied field is sufficient. (C) 2011 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectElectroless-platingen_US
dc.subjectNickel-phosphorus alloyen_US
dc.subjectAnisotropyen_US
dc.subjectStructural morphologyen_US
dc.subjectTransmission electron microscopyen_US
dc.subjectAtomic force microscopyen_US
dc.subjectMagnetic propertiesen_US
dc.titleStructural morphology and magnetism of electroless-plated NiP films on a surface-modified Si substrateen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.tsf.2011.09.025en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume520en_US
dc.citation.issue3en_US
dc.citation.spage1102en_US
dc.citation.epage1108en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000298486600037-
Appears in Collections:Conferences Paper


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