標題: | Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability |
作者: | Chu, Min-Ching Meena, Jagan Singh Cheng, Chih-Chia You, Hsin-Chiang Chang, Feng-Chih Ko, Fu-Hsiang 應用化學系 奈米科技中心 Department of Applied Chemistry Center for Nanoscience and Technology |
公開日期: | 1-八月-2010 |
摘要: | We demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO2 film on a plastic polyimide substrate based on a simple and low-cost sal-gel precursor spin-coating process. The surface morphology of the ZrO2 film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO2 film under suitable treatment of oxygen (O-2) plasma and then subsequent annealing at 250 degrees C exhibits superior low leakage current density of 9.0 x 10(-9) A/cm(2) at applied voltage of 5 V and maximum capacitance density of 13.3 fF/mu m(2) at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O-2 plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O-2 plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature. (C) 2010 Elsevier Ltd. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.microrel.2010.05.004 http://hdl.handle.net/11536/149999 |
ISSN: | 0026-2714 |
DOI: | 10.1016/j.microrel.2010.05.004 |
期刊: | MICROELECTRONICS RELIABILITY |
Volume: | 50 |
起始頁: | 1098 |
結束頁: | 1102 |
顯示於類別: | 期刊論文 |