標題: Effect of annealing on the electrodeposited Cu2O films for photoelectrochemical hydrogen generation
作者: Liang, Ru-Meng
Chang, Yun-Min
Wu, Pu-Wei
Lin, Pang
交大名義發表
材料科學與工程學系
National Chiao Tung University
Department of Materials Science and Engineering
關鍵字: Cu2O;Electrodeposition;Photoelectrochemical hydrogen generation
公開日期: 1-十月-2010
摘要: Cu2O films were electrodeposited on stainless steel substrates followed by Ar annealing for photoelectrochemical hydrogen generation. Plating variables including time and pH for the plating bath were explored to obtain desirable film qualities. X-ray diffraction (XRD) patterns indicated that the as-deposited Cu2O films exhibited preferred orientations in (200) and (111) planes from the plating bath of pH 9 and pH 11, respectively. Images from scanning electron microscope (SEM) revealed pyramid-like grains in 1 mu m size for the Cu2O films from pH 9 plating bath and large plate-like grains in 3-8 mu m size from pH 11 plating bath. Identical results from SEM and XRD were obtained from the Cu2O films at longer plating time. After annealing at 350 degrees C for 30 and 60 min, the Cu2O phase was nicely maintained but SEM images demonstrated coarser grains. Photoelectrochemical activity for H-2 generation was obtained on the Cu2O films before and after annealing by recording relevant photoelectrochemical currents at -0.3 V in 0.5 M aqueous Na2SO4 solution. For the Cu2O films from both baths, substantial increments in photoelectrochemical current were observed for the annealed samples as opposed to as-deposited ones. The largest photoelectrochemical current was obtained at 0.143 mA/cm(2) from the Cu2O film of pH 9 plating bath with 60 min annealing, which exhibited a 560% increase over the as-deposited sample. We attributed the enhanced photoelectrochemical current to the improved crystallinity and reduced defects for the annealed Cu2O films. (C) 2010 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.tsf.2010.04.073
http://hdl.handle.net/11536/150074
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2010.04.073
期刊: THIN SOLID FILMS
Volume: 518
起始頁: 7191
結束頁: 7195
顯示於類別:期刊論文