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dc.contributor.authorHuang, H. W.en_US
dc.contributor.authorHuang, J. K.en_US
dc.contributor.authorLee, K. Y.en_US
dc.contributor.authorLin, C. F.en_US
dc.contributor.authorKuo, H. C.en_US
dc.date.accessioned2019-04-02T06:00:20Z-
dc.date.available2019-04-02T06:00:20Z-
dc.date.issued2010-06-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2010.2045218en_US
dc.identifier.urihttp://hdl.handle.net/11536/150151-
dc.description.abstractGaN-based LEDs with a SiO2 oxide PQC pattern on an n-GaN layer by nanoimprint lithography are fabricated and investigated. At a driving current of 20 mA on a Transistor-Outline-can package, the light output power of LED III (d = 1.2 mu m) was enhanced by a factor of 1.20. The internal-quantum-efficiency result offers promising potential to enhance the light output power of commercial light-emitting devices with a SiO2 oxide PQC structure on an n-GaN layer.en_US
dc.language.isoen_USen_US
dc.subjectGallium nitride (GaN)en_US
dc.subjectlight-emitting diodes (LEDs)en_US
dc.subjectphotonic quasi-crystal (PQC)en_US
dc.titleLight-Output-Power Enhancement of GaN-Based Light-Emitting Diodes on an n-GaN Layer Using a SiO2 Photonic Quasi-Crystal Overgrowthen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2010.2045218en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume31en_US
dc.citation.spage573en_US
dc.citation.epage575en_US
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:000284097800009en_US
dc.citation.woscount4en_US
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