Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chang, Wei-Ling | en_US |
dc.contributor.author | Meng, Chinchun | en_US |
dc.contributor.author | Wong, Shyh-Chyi | en_US |
dc.contributor.author | Chien, Hwey | en_US |
dc.contributor.author | Huang, Guo-Wei | en_US |
dc.date.accessioned | 2019-04-02T06:04:51Z | - |
dc.date.available | 2019-04-02T06:04:51Z | - |
dc.date.issued | 2015-01-01 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/150650 | - |
dc.description.abstract | This paper demonstrates a new temperature insensitive bias circuit using a Wilson current mirror for the InGaP/GaAs HBT power amplifier. The Wilson current mirror has a high impedance node for connecting an on/off digital interface and a stable voltage node for injection of feedback signals to achieve a temperature insensitive bias. The fabricated output stage of the power amplifier with the feedback through the Wilson current source shows a stable bias current with current variation from 186 mA to 182 mA for the temperature range from 25 degrees C to 200 degrees C. A bias circuit without the feedback through the Wilson current source is also fabricated for comparison and shows a strong bias current variation over temperature. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | InGaP/GaAs HBT | en_US |
dc.subject | temperature insensitive | en_US |
dc.subject | power amplifier | en_US |
dc.subject | Wilson current mirror | en_US |
dc.title | Temperature Insensitive PA Bias Circuit With Digital Control Interface Using InGaP/GaAs HBT Technology | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2015 10TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC) | en_US |
dc.citation.spage | 432 | en_US |
dc.citation.epage | 435 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000377769200107 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |