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dc.contributor.authorLin, Cosette Y. H.en_US
dc.contributor.authorHuang, Ryan H. -M.en_US
dc.contributor.authorWen, Charles H. -P.en_US
dc.contributor.authorChang, Austin C. -C.en_US
dc.date.accessioned2019-04-02T06:04:51Z-
dc.date.available2019-04-02T06:04:51Z-
dc.date.issued2013-01-01en_US
dc.identifier.issn2474-2724en_US
dc.identifier.urihttp://hdl.handle.net/11536/150683-
dc.description.abstractAging and soft errors have become the two most critical reliability issues for nano-scaled CMOS designs. In this paper, the aging effect due to negative bias temperature instability (NBTI) is first analyzed on cells using a 45nm CMOS technology for soft errors. Second, an accurate statistical soft-error-rate (SSER) framework is built and incorporates the aging-aware cell models. As a result, two findings are discovered: (1) PMOS-induced transient faults, comparing to NMOS-induced ones, have more variation in pulse widths since PMOS is more susceptible to NBTI; (2) NBTI together with process variation, induces more soft errors (similar to 19%) and thus needs to be considered, simultaneously, during circuit analysis. Experimental result shows that our SSER framework considering both process variation and aging is efficient (with multiple-order speedups) and achieves high accuracy (with <3% errors) when compared with Monte-Carlo SPICE simulation.en_US
dc.language.isoen_USen_US
dc.titleAging-aware Statistical Soft-Error-Rate Analysis for Nano-Scaled CMOS Designsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION, AND TEST (VLSI-DAT)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000393052900057en_US
dc.citation.woscount0en_US
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